Title:
HEAT INSULATION PLATE WITH PRESSURE SENSITIVE ADHESIVE, AND HEAT INSULATION CONSTRUCTION METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2007100406
Kind Code:
A
Abstract:
To provide new heat insulation plates with a pressure sensitive adhesive, which can be stored and transported in a manner being superposed on each other without having release papers attached thereto.
Each heat insulation plate 2 has the pressure sensitive adhesive 3 applied to one surface thereof in a predetermined application pattern, and has recesses 4 formed in the other surface in a region corresponding to the application pattern of the pressure sensitive adhesive 3. Therefore when the plurality of heat insulation plates 1 each with the pressure sensitive adhesive are superposed on each other, the pressure sensitive adhesive 3 can be protected by the recesses 4.
Inventors:
HATANAKA JUNICHIRO
Application Number:
JP2005292360A
Publication Date:
April 19, 2007
Filing Date:
October 05, 2005
Export Citation:
Assignee:
DOW KAKO KK
International Classes:
E04B1/80
Domestic Patent References:
| JPH08266390A | 1996-10-15 | |||
| JPS61273315A | 1986-12-03 | |||
| JPH11293902A | 1999-10-26 | |||
| JP2005002654A | 2005-01-06 | |||
| JPH06212722A | 1994-08-02 | |||
| JPH0754433A | 1995-02-28 |
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi
Yoshihiro Yamaguchi
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