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Patent Searching and Data


Title:
HEAT INSULATION STRUCTURE AND ITS CONSTRUCTION METHOD
Document Type and Number:
Japanese Patent JP2005042447
Kind Code:
A
Abstract:

To provide a heat insulation structure excellent in the same heat insulation level, sound insulation level, non condensing property, fire resistance as the case that urethane foam is sprayed onto the indoor side face of a base member.

A heat insulation material layer is formed on the indoor side surface of the base member separating the indoor side of the building from the outdoor side, a board material is attached to the indoor side surface of the heat insulation material layer through an adhesive to form the heat insulation structure. The heat insulation structure has a feature in that the heat insulation material layer is formed of the heat insulation composition including 100 pts. wt. of cement, 4 or more pts.wt. of foam organic resin powder, 5-300 pts.wt. of inorganic aggregate, 1-50 pts.wt. of organic binder, and 1-50 pts.wt. of fiber.


Inventors:
HORI OSAO
TAKAHASHI KOICHIRO
YAMADA MASAKI
KARUGA HIDETO
Application Number:
JP2003278648A
Publication Date:
February 17, 2005
Filing Date:
July 23, 2003
Export Citation:
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Assignee:
OHBAYASHI CORP
SK KAKEN CO LTD
International Classes:
E04B1/76; E04B1/80; (IPC1-7): E04B1/76; E04B1/80
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano