Title:
HEAT INSULATION STRUCTURE
Document Type and Number:
Japanese Patent JP2014139467
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulation structure which reduces an installation space while ensuring heat insulation and heat resistance.SOLUTION: A second heat insulation material 4 is provided at a heat-retention object part 2 through a first heat insulation material 3. The first heat insulation material 3 is formed by a material which is more excellent in heat resistance than the second heat insulation material 4. The second heat insulation material 4 is formed by a material which is more excellent in heat insulation than the first heat insulation material 3. The first heat insulation material 3 is formed by a material having a heat resistant temperature higher than a temperature of the heat-retention object part 2. A thickness of the first heat insulation material 3 is set so that a temperature on an outer surface of the first heat insulation material 3 is lower than or equal to a heat resistant temperature of the second heat insulation material 4.
Inventors:
ITO KO
Application Number:
JP2013008735A
Publication Date:
July 31, 2014
Filing Date:
January 21, 2013
Export Citation:
Assignee:
MIURA KOGYO KK
International Classes:
F16L59/02; B32B5/18; B32B27/40; F16L59/04
Domestic Patent References:
| JPH11241428A | 1999-09-07 | |||
| JP2012031392A | 2012-02-16 | |||
| JP3174323U | 2012-03-15 | |||
| JP2008169989A | 2008-07-24 | |||
| JPH0671999U | 1994-10-07 | |||
| JPH0596694U | 1993-12-27 |
Foreign References:
| US6403180B1 | 2002-06-11 | |||
| US20070102055A1 | 2007-05-10 |
Attorney, Agent or Firm:
Koyama