Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT INSULATION WATERPROOF STRUCTURE AND HEAT INSULATION WATERPROOFING CONSTRUCTION METHOD
Document Type and Number:
Japanese Patent JP2009041303
Kind Code:
A
Abstract:

To provide a heat insulation waterproof structure of a structure and a heat insulation waterproofing construction method for the structure by use of a resin foaming material having excellent heat resistance.

This heat insulation waterproof structure 1 is provided with a heat insulation material 3 laminated on a substrate 2 of the structure, a fixing fitting 4 having a heat fusing material on a face exposed onto a surface side of the heat insulation material 3, fixed on the substrate 2 by anchoring, and fixing the heat insulating material 3 on the substrate 2, and a sheet 5 made of vinyl chloride resin laid on the heat insulation material 3 and stuck to the fixing fitting 4 by the heat fusing material. The heat insulation material 3 is formed by foaming a resin compound containing a copolymer A constituted of an aromatic vinyl unit, an unsaturated dicarboxylic acid anhydride unit, and an N-alkyl substitutional maleimide unit and a copolymer B constituted of an aromatic vinyl unit and a vinyl cyanide unit.


Inventors:
SATO TAKEISHI
KOBAYASHI HIROSHI
Application Number:
JP2007209129A
Publication Date:
February 26, 2009
Filing Date:
August 10, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEKA CORP
International Classes:
E04D11/00; B32B27/30
Domestic Patent References:
JPH11336268A1999-12-07
JPH0425532A1992-01-29