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Title:
HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND METHOD FOR CUT-PROCESSING LAMINATED CERAMIC SHEET
Document Type and Number:
Japanese Patent JP2010214947
Kind Code:
A
Abstract:

To provide a heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet, which exhibits sufficient pressure-sensitive adhesiveness upon cut-processing at room temperature and under a high-temperature atmosphere and is easily peeled by heating upon peeling.

The heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet has such a composition that a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesion-imparting resin is formed on at least one side surface of a substrate and is used for temporary fixing upon cutting of a laminated ceramic sheet, wherein a gel fraction of the heat-expandable pressure-sensitive adhesive layer is 50 wt.% or more, an acid value of a base polymer of a pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer is 350 mg-KOH/g or less and an acid value of the pressure-sensitive adhesion-imparting resin in the heat-expandable pressure-sensitive adhesive layer is 80 mg-KOH/g or less. The base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer is preferably an acryl-based polymer. Further, the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer preferably contains a crosslinking agent.


Inventors:
YANAGI YUICHIRO
SHIMOKAWA DAISUKE
ARIMITSU YUKIO
Application Number:
JP2010036010A
Publication Date:
September 30, 2010
Filing Date:
February 22, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B28B11/14; C09J7/22; C09J7/38; C09J11/06; C09J133/04
Domestic Patent References:
JP2003160765A2003-06-06
JP2005281418A2005-10-13
JP2003338678A2003-11-28
JP2008195888A2008-08-28
JP2006348143A2006-12-28
JPS6333487A1988-02-13