Title:
HEAT PIPE CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2003329379
Kind Code:
A
Abstract:
To provide a heat pipe circuit board for allowing the circuit board itself to have the cooling function for enhancing heat radiation of heat generated from an electronic part.
This heat pipe circuit board has a heat pipe, an insulating layer of at least one layer, a circuit pattern arranged on a surface or the inside of the insulating layer, and the electronic part mounted on the heat pipe via the insulating layer. The heat pipe joins two plate materials of arranging a recessed part being a passage of an operating liquid on at least one plate material by a frictional agitation joining method.
More Like This:
| JP2021065925 | JOINING METHOD |
| JP5450486 | Hollow parts and their manufacturing methods and equipment |
| JP7398898 | Motor core structure and its formation method |
Inventors:
SAIDA YUKIHIRO
MASHITA KEIJI
MASHITA KEIJI
Application Number:
JP2002135936A
Publication Date:
November 19, 2003
Filing Date:
May 10, 2002
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B23K20/12; F28D15/02; H05K1/02; H05K7/20; B23K101/14; B23K101/42; (IPC1-7): F28D15/02; B23K20/12; H05K1/02; H05K7/20
Attorney, Agent or Firm:
Kawawa Takaho
Previous Patent: HEAT EXCHANGER OF DRY DEHUMIDIFIER
Next Patent: METHOD OF MANUFACTURING HEAT PIPE AND MANUFACTURING DEVICE
Next Patent: METHOD OF MANUFACTURING HEAT PIPE AND MANUFACTURING DEVICE