Title:
HEAT PIPE AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2012163227
Kind Code:
A
Abstract:
To provide a heat pipe that can more efficiently cool electronic components requiring inductance.
A heat pipe 20 is a laminate 21 constituted by laminating flat plates includes: the laminate 21 formed by laminating flat plates and having capillary tubes formed in the interior thereof; and a working fluid contained in the capillary tubes and operable to transfer heat. In the heat pipe, the laminate 21 is formed by laminating metal flat plates 26 having an insulation film 28 formed on each surface thereof where insulating layers formed of an insulating material and metal layers formed of a metal material are alternately laminated.
Inventors:
FURUTA NORIBUMI
Application Number:
JP2011022054A
Publication Date:
August 30, 2012
Filing Date:
February 03, 2011
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
F28D15/02; H05K7/20; H01L23/427
Domestic Patent References:
| JP2000138485A | 2000-05-16 | |||
| JPH07122402A | 1995-05-12 | |||
| JPH10261534A | 1998-09-29 | |||
| JPH0496648A | 1992-03-30 | |||
| JP2000138485A | 2000-05-16 | |||
| JPH07122402A | 1995-05-12 | |||
| JPH10261534A | 1998-09-29 | |||
| JPH0496648A | 1992-03-30 | |||
| JP2009212384A | 2009-09-17 | |||
| JPH01101153U | 1989-07-07 | |||
| JP2003507994A | 2003-02-25 | |||
| JP2010288424A | 2010-12-24 | |||
| JP2010119297A | 2010-05-27 | |||
| JP2010156533A | 2010-07-15 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office