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Title:
HEAT PIPE PANEL FOR SATELLITE
Document Type and Number:
Japanese Patent JP2003276696
Kind Code:
A
Abstract:

To mount appliances on both sides of a heat pipe panel, to dispose the panel inside a satellite, and, in particular, to mount a large number of TWTAs.

Appliances are mounted on both sides of the heat panel, the panel is disposed inside the satellite, and, in particular, a large number of TWTAs are mounted by providing a heat pipe group comprising a skin with appliances mounted thereon, a honeycomb core in contact with the skin, and heat pipes in contact with the skin and embedded in the honeycomb core, a second heat pipe group comprising heat pipes in contact with the heat pipe group, orthogonal thereto, and embedded in the honeycomb core, a third heat pipe group comprising heat pipes in contact with the second heat pipe group, orthogonal thereto, and embedded in the honeycomb core, and a radiator having the skin on which the appliances in contact with the third heat pipe group and connected to the second heat pipe group.


Inventors:
KABASHIMA SHIGENORI
HAHN STEVEN
OZAKI TAKESHI
Application Number:
JP2002088479A
Publication Date:
October 02, 2003
Filing Date:
March 27, 2002
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B64G1/50; F28D15/02; (IPC1-7): B64G1/50; F28D15/02
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)