To improve cooling performance of a device by partially fixing a heat pipe wherein a plurality of heat sinks are integrally provided at both end parts to a heat reception body, for very efficient transfer of a heat from the heat reception plate to a heat sink.

A heat pipe type cooling device 1 is provided with, for example, a square heat reception plate 3 and a heat pipe H wherein, the entire is almost U-shape, its bent intermediate part is fixed to the center of the heat reception plate 3. The both end side parts of the heat pipe are extending, straight, upward parallel to each other. The parts of the heat pipe penetrate a plurality of heat sinks 5 which are, almost identical shape with the heat reception plate 3, allocated parallel to each other, one above another, with a specified interval. The cooling device 1 is for example, placed on an LSI, and tightly fitted/fixed, for example, using a clip C, so that the heat generated at the LSI is transferred to the heat sink 3, and then very efficiently transferred to the heat sink 5 through the heat pipe H, and eventually, dissipated/diverged outside effectively from the heat sink 5.