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Title:
HEAT PLATE FOR LAMINATING DEVICE
Document Type and Number:
Japanese Patent JP2013010330
Kind Code:
A
Abstract:

To provide a heat plate capable of keeping a temperature in a surface of a heat plate uniform in a laminating machining process, and to provide a laminating device using the heat plate.

The heat plate for a laminating device is the heat plate for the laminating device which is provided with an upper chamber and a lower chamber which are separated through a pressing member, wherein a workpiece 10 is loaded on the heat plate 20 arranged in the lower chamber; the workpiece 10 is heated through the heat plate 20 so as to vacuumize the lower chamber, and the air is introduced into the upper chamber, the workpiece is clamped and laminated by the heat plate 20 and the pressing member; the heat plate 20 is internally provided with a plurality of heaters 203 or a plurality of groups of paired heaters 203 and heating pipes 204; and furthermore, temperature sensors 207 are further arranged on at least three positions along the direction of conveying the workpiece loaded on the heat plate 20. The temperature in the surface of the heat plate is controlled to be uniformly distributed.


Inventors:
SHINODA TAKASHI
NAKAMURA MASANORI
Application Number:
JP2011145989A
Publication Date:
January 17, 2013
Filing Date:
June 30, 2011
Export Citation:
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Assignee:
NISSHINBO MECHATRONICS INC
International Classes:
B29C63/16; H01L31/042
Domestic Patent References:
JP2000081918A2000-03-21
JP2002109501A2002-04-12
JP2001188893A2001-07-10
JP2003300255A2003-10-21
JP2008047766A2008-02-28