Title:
HEAT PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2023027326
Kind Code:
A
Abstract:
To equalize a temperature distribution among respective points in a work area where a processing object is heat processed.SOLUTION: A heat processing device 1 of this invention comprising an upstream section 7 into which heat processing gas flows and a downstream section 5 from which the heat processing gas flows out includes: a work area 4 where a heat processing object 100 is placed between the upstream section 7 and the downstream section 5; a suction port 17 that suctions the heat processing gas in the work area 4 via the downstream section 5; and a downstream flow rate adjustment section 6. The downstream flow rate adjustment section 6 is configured to set, in the downstream section 5, a flow rate of the heat processing gas in a proximal section 27 which is relatively close to the suction port 17 to be smaller than a flow rate of the head processing gas in a distal section 28 which is relatively far from the suction port 17.SELECTED DRAWING: Figure 1
Inventors:
Junji Nakatani
Toshikazu Iwao
Shotaro Morimoto
Toshikazu Iwao
Shotaro Morimoto
Application Number:
JP2022203457A
Publication Date:
March 01, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
JTEKT Thermo System Co., Ltd.
International Classes:
F27B5/04; F27B5/16; F27B5/14; F27D7/02; F27D7/06
Attorney, Agent or Firm:
Patent Attorney Corporation Britus
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