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Patent Searching and Data


Title:
Heat pump air harmony device
Document Type and Number:
Japanese Patent JP5987479
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump type air conditioner which can enhance reliability of a refrigerant temperature for use in computation of a degree of supercooling, and can enhance computation precision of the degree of supercooling.SOLUTION: In a heat pump type air conditioner which has a refrigerant circuit A including: an outdoor heat exchanger 1; a plurality of indoor units 2 and 3; a first flow path 91 which joins discharge ports upon heating of a plurality of indoor heat exchangers 21 and 31, and interconnects a confluent portion with an admission port upon heating of the outdoor heat exchanger 1; and compressors 51 and 52, the air conditioner includes: a temperature estimation part 102 which estimates a temperature of a refrigerant after join in the first flow path 91 upon heating based on a detection result of indoor liquid pipe temperature sensors 24 and 34, a value equivalent to a maximum refrigerant flow rate of indoor expansion valves 23 and 33, and an opening of the indoor expansion valves 23 and 33; and a supercooling degree computation part 103 for computing the degree of supercooling of the refrigerant circuit A by utilizing an estimated temperature as a temperature estimated by the temperature estimation part 102.

Inventors:
Ken Ueda
Application Number:
JP2012124655A
Publication Date:
September 07, 2016
Filing Date:
May 31, 2012
Export Citation:
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Assignee:
Aisin Seiki Co., Ltd.
International Classes:
F25B1/00; F24F11/02; F25B6/02; F25B13/00
Domestic Patent References:
JP8219572A
JP5018594A
JP2006292281A
JP10089780A
JP8049931A
JP2012032108A
JP2010270971A
JP2008232569A
Foreign References:
US20110154834
Attorney, Agent or Firm:
Hiroshi Okawa