Title:
HEAT PUMP APPARATUS
Document Type and Number:
Japanese Patent JP2001255025
Kind Code:
A
Abstract:
To improve the capability of a heat pump apparatus upon heating operation without making the heat pump apparatus large-sized by providing a heater on a refrigerant circuit.
Temperature of a refrigerant passing through a refrigerant piping (6) is increased by making use of an electric heater provided between an indoor heat exchanger (2) of a refrigerant circuit and expansion means (4). As a result, load of heating capability of an outdoor heat exchanger (5) is reduced to prevent the outdoor heat exchange (5) from becoming large-sized.
Inventors:
YABU TOMOHIRO
YOSHIMI ATSUSHI
YOSHIMI ATSUSHI
Application Number:
JP2000066451A
Publication Date:
September 21, 2001
Filing Date:
March 10, 2000
Export Citation:
Assignee:
DAIKIN IND LTD
International Classes:
F25B1/00; (IPC1-7): F25B1/00
Attorney, Agent or Firm:
Hiroshi Maeda (1 person outside)
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