Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP CYCLE DEVICE
Document Type and Number:
Japanese Patent JP2011069570
Kind Code:
A
Abstract:

To provide a heat pump cycle device performing subcooling operation corresponding to various operating conditions and improving operation efficiency.

The heat pump cycle device includes: a refrigerant circuit constituted by sequentially interconnecting a compressor 1, a use side heat exchanger 3 exchanging heat between water and a refrigerant, an electronic expansion valve 4 and an outdoor heat exchanger 5 by piping; a control means 7 controlling the refrigerant circuit; a subcooling calculation means 14 calculating subcooling of the refrigerant circuit; a condensation pressure detection means 13 detecting condensation pressure of the compressor 1; a compressor rotational frequency detection means 7b detecting rotational frequency of the compressor 1; and a target subcooling extraction means 7a determining target subcooling based on the condensation pressure and the rotational frequency of the compressor 1. The control means 7 controls an opening of the electronic expansion valve 4 so that the subcooling of the refrigerant circuit becomes a target subcooling temperature.


Inventors:
ITAGAKI ATSUSHI
SUGIYAMA TAKASHI
FUJI TOSHIYUKI
ABIKO HIROSHI
Application Number:
JP2009222184A
Publication Date:
April 07, 2011
Filing Date:
September 28, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU GENERAL LTD
International Classes:
F25B1/00; F24D3/00; F24F11/02
Domestic Patent References:
JPH0828985A1996-02-02
JPH04363552A1992-12-16
JP2006200843A2006-08-03
JP2005140431A2005-06-02
JP2004012127A2004-01-15
JP2002081767A2002-03-22



 
Previous Patent: HEATING COOKER

Next Patent: AIR CONDITIONER