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Title:
ヒートポンプ装置及び貯湯式給湯機
Document Type and Number:
Japanese Patent JP7327630
Kind Code:
B2
Abstract:
A heat pump device (100) comprising: a housing (102) having a second panel (41) that serves as an outer wall; a compressor (12) for compressing a refrigerant; a liquid-refrigerant heat exchanger (2) for exchanging heat between the refrigerant and a liquid; and a circulation pump (8) for supplying the liquid to the liquid-refrigerant heat exchanger (2). The compressor (12) and the liquid-refrigerant heat exchanger (2) are disposed in the housing (102). The circulation pump (8) is disposed outside the second panel (41) of the housing (102).

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Inventors:
Takashi Tanaka
Shuji Motegi
Application Number:
JP2022500189A
Publication Date:
August 16, 2023
Filing Date:
February 14, 2020
Export Citation:
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Assignee:
Mitsubishi Electric Corporation
International Classes:
F25B1/00; F24H4/02; F25B30/02
Domestic Patent References:
JP2012251701A
JP2009299973A
Foreign References:
WO2019130439A1
Attorney, Agent or Firm:
Patent Attorney Takada / Takahashi International Patent Office