Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2010210224
Kind Code:
A
Abstract:
To provide a heat pump device capable of suppressing increase of an installation area and a volume.
In this heat pump device 1 provided with a turbo compressor 5 for compressing a refrigerant, a condenser 2 for liquefying the compressed refrigerant, and an evaporator 4 for evaporating the liquefied refrigerant, the condenser 2 and the evaporator 4 are plate-type heat exchangers formed into the rectangular parallelopiped shape, and the condenser 2 as the plate type heat exchanger and the evaporator 4 as the plate-type heat exchanger are disposed side-by-side.
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Inventors:
NISHII KENICHIRO
UEDA KENJI
WAJIMA KAZUYOSHI
UEDA KENJI
WAJIMA KAZUYOSHI
Application Number:
JP2009060177A
Publication Date:
September 24, 2010
Filing Date:
March 12, 2009
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
F25B1/04; F25B39/02; F25B30/02; F25B31/00; F25B39/04; F25B43/00; F25B43/02
Domestic Patent References:
| JP2000018735A | 2000-01-18 | |||
| JPH08285401A | 1996-11-01 | |||
| JP2002364936A | 2002-12-18 | |||
| JP2000292011A | 2000-10-20 | |||
| JPH10267427A | 1998-10-09 | |||
| JPH024164U | 1990-01-11 | |||
| JP2007255831A | 2007-10-04 | |||
| JP2007139262A | 2007-06-07 |
Attorney, Agent or Firm:
Noriharu Fujita
Kunio Ueda
Kunio Ueda