Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2017026159
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump device by which a small size, an inexpensive price and high reliability are obtained and which suppresses refrigerant stagnation and maintains comfortability during defrosting while having high energy saving characteristics.SOLUTION: A heat pump device 1 has a refrigerant circuit 8 in which a compressor 2, a first heat exchange unit 4, an expansion device 6 and a second heat exchanger 7 are connected through piping and a refrigerant flows, and a control part 21 controlling operation of the refrigerant circuit 8. The first heat exchange unit 4 has plural auxiliary heat exchange parts connected in series, and an auxiliary expansion device 43 provided between the plural auxiliary heat exchange parts. The control part 21 has a defrosting time control means 22 which increases a pressure difference between the refrigerant flowing in the upstream side of the auxiliary expansion device 43 when defrosting the auxiliary heat exchange parts and the refrigerant flowing in the downstream side of the auxiliary expansion device 43 by the auxiliary expansion device 43.SELECTED DRAWING: Figure 1
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Inventors:
FUJITSUKA MASASHI
TSUCHINO KAZUNORI
TSUCHINO KAZUNORI
Application Number:
JP2013251439A
Publication Date:
February 02, 2017
Filing Date:
December 04, 2013
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F25B47/02; F25B1/00; F25B5/04; F25B41/00; F25B41/04
Attorney, Agent or Firm:
Patent Business Corporation Kisa Patent Trademark Office
Previous Patent: JP2017026158
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