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Title:
HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2020071002
Kind Code:
A
Abstract:
To provide a heat pump device capable of preventing a region where vacuum suction is not performed or a refrigerant is not injected from being provided in a circuit.SOLUTION: A heat pump device 10 in which a service port 34 is provided in a circuit 15 formed by connecting a compressor 11, a first heat exchanger 12, a pressure reduction valve 13 and a second heat exchanger 14 includes: solenoid valves 23, 24, 25, 31, 32 that are brought into a restricted state for restricting a flow of fluid in the circuit 15 in the non-energized state and brought into a non-restricted state for preventing restriction of a flow of the fluid in the circuit 15 in the energized state; control means 40 for switching the solenoid valves 23, 24, 25, 31, 32 between the restricted state and the non-restricted state; and an input section 42 connected to the control means 40. The control means 40 detects the fact that predetermined input has been performed by the input section 42 to forcedly cause the solenoid valves 23, 24, 25, 31, 32 to be brought into the non-restricted state and/or forcedly cause the pressure reduction valves 13, 27 to be brought into the opened state.SELECTED DRAWING: Figure 1

Inventors:
AKABANE NOZOMI
NISHIDA YUKIO
Application Number:
JP2018206713A
Publication Date:
May 07, 2020
Filing Date:
November 01, 2018
Export Citation:
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Assignee:
CHOFU SEISAKUSHO CO LTD
International Classes:
F25B45/00; F25B1/00; F25B41/04
Domestic Patent References:
JPH04240365A1992-08-27
JP2008039308A2008-02-21
JPS5872848A1983-04-30
JPH02187580A1990-07-23
JP2008241072A2008-10-09
JP2008089304A2008-04-17
JP2015007501A2015-01-15
JP2001349645A2001-12-21
JP2011052842A2011-03-17
JP2017075767A2017-04-20
Attorney, Agent or Firm:
Fujio Nakamae
Yohei Kiyoi



 
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