HEAT PUMP DEVICE - DAIKIN IND LTD

Title:

HEAT PUMP DEVICE

Document Type and Number:

Japanese Patent JP2020173090

Kind Code:

A

Abstract:

To provide a heat pump device having improved heat exchange capacity.SOLUTION: A heat pump device 10 includes: a casing 11 having a first side wall 14 and a second side wall 15 opposing to each other and an upper wall 12; and a heat exchanger 25 and fans 37, 65 accommodated in the casing 11. A first air introduction port 19 and a second air introduction port 20 are provided on the first side wall 14 and the second side wall 15, respectively, and a first air blowout port 22 is provided on the upper wall 12. The heat exchanger 25 includes a first heat exchange part 33 disposed along the first side wall 14 and a second heat exchange part 34 disposed along the second side wall 15. The fans 37, 65 are disposed to be sandwiched between the first heat exchange part 33 and the second heat exchange part 34, has a rotating shaft 40 in the direction intersecting with the first side wall 14 and the second side wall 15, introduces air from the first air introduction port 19 and the second air introduction port 20 and discharges the air from the first air blowout port 22.SELECTED DRAWING: Figure 2

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