Title:
ヒートポンプ装置
Document Type and Number:
Japanese Patent JP6442424
Kind Code:
B2
Abstract:
The invention provides a heat pump device. Thus, control can be performed in a way of reducing the time when it is quite hard for capillary tubes to start rotating until the load is reduced; and following adjustment can be performed that the bigger the load is, the more the refrigerants flow and the smaller the load is, the few the refrigerants flow, so reduction of the cost is facilitated without the need to worry about the connection work. According to the invention, a condenser (42), an evaporator (41), a pressure reduction device arranged between the condenser (42) and the evaporator (41) and a compressor (43) for compressing the refrigerants are connected in an annular manner so that the heat pump device is formed. The heat pump device is characterized in that the heat pump device comprises a pressure reducing device, an expansion device 1 and an expansion unit 2; the pressure reducing device consists of a slide valve (1) with an inlet side port (2a) and two outlet side ports (8, 9) with different opening areas; the outlet side port (8) with the large opening area forms the expansion unit when the operation with the big load begins; and the outlet side port (9) with the small opening area forms the expansion unit when the load change is reduced.
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Inventors:
Kazuhiko Osawa
Application Number:
JP2016042161A
Publication Date:
December 19, 2018
Filing Date:
March 04, 2016
Export Citation:
Assignee:
Saginomiya Co., Ltd.
International Classes:
D06F33/02; F25B41/06; F16K11/065; F25B41/04
Domestic Patent References:
JP2007175528A | ||||
JP11201306A | ||||
JP2004156700A | ||||
JP2004108764A | ||||
JP2004286322A | ||||
JP2015110993A |
Foreign References:
US4394816 |
Attorney, Agent or Firm:
Patent corporation ssinpat