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Title:
HEAT PUMP HOT WATER SUPPLY AND HEATING APPARATUS
Document Type and Number:
Japanese Patent JP2004317093
Kind Code:
A
Abstract:

To provide a heat pump hot water supply and heating apparatus, using an operational capability variable heat pump device as a heat source, whereby during hot water single operation without heating operation, and during heating single operation without hot water supply operation, the heat pump device is operated at low output to hold down noise and reduce power consumption, and during the simultaneous heating and hot water supply operation, the device is operated at maximum capacity to prevent running-out of hot water.

This heat pump hot water supply and heating apparatus includes: a hot water storing device 2; a heating device 4; and the operating capability variable heat pump device 3. The heat pump device 3 is taken as a heat source to perform the hot water storing operation for boiling hot water in a storing tank 6 of the hot water storing device 2 and the heating operation for radiating heat from a radiator of the heating device. During the hot water storing single operation or during the heating single operation, the heat pump device 3 is operated with the capability depending on the respective loads. During the hot water storing and heating operation for simultaneously performing the hot water storing operation and the heating operation, the heat pump device 3 is operated at the maximum capability. The capability is the sum of the capability during the hot water storing single operation and the capability during the heating single operation.


Inventors:
YAGUCHI MASAHIKO
Application Number:
JP2003115326A
Publication Date:
November 11, 2004
Filing Date:
April 21, 2003
Export Citation:
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Assignee:
TOSHIBA ELECTRIC APPLIANCE
International Classes:
F24H1/00; (IPC1-7): F24H1/00