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Patent Searching and Data


Title:
HEAT PUMP HOT WATER SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2007132622
Kind Code:
A
Abstract:

To effectively use energy in a heat pump hot water supply device using a fluid transportation device with a compressor and an expander connected by the same rotational shaft.

A refrigerant circuit 11 has the fluid transportation device 16, a compressing device 15, a radiator 17, and an evaporator 20. The fluid transportation device 16 has a compression part 16A and an expansion part 16B. The expansion part 16B is connected with a rotational shaft 16C of the compression part 16A. The compressing device 15 is connected in parallel with the compression part. Refrigerant discharged from at least one of the compression part and the compressing device 15 flows into the radiator 17. The refrigerant discharged from the expansion part flows into the evaporator 20.


Inventors:
NAKAYAMA HIROSHI
TAIRA SHIGEJI
Application Number:
JP2005327624A
Publication Date:
May 31, 2007
Filing Date:
November 11, 2005
Export Citation:
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Assignee:
DAIKIN IND LTD
International Classes:
F25B31/00; F25B1/00; F25B1/10; F25B11/02
Domestic Patent References:
JP2004212006A2004-07-29
JP2005291622A2005-10-20
JP2004150748A2004-05-27
JPS55126773A1980-09-30
Attorney, Agent or Firm:
Yukio Ono
Hidetada Kato
Yamashita
Hiroharu Kitahara