Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP AND HOT WATER SUPPLY SYSTEM
Document Type and Number:
Japanese Patent JP2013142507
Kind Code:
A
Abstract:

To provide a heat pump having a high performance coefficient with a simple configuration.

A heat pump includes a medium circuit having a compressor, a condenser, an expander and an evaporator. At least any one of the evaporator and the condenser is configured to include a self-excited vibration heat pipe comprising: a pipe line which reciprocates by a plurality of times between a first area and a second area having a temperature lower than that of the first area and which includes a heat-receiving part for performing heat exchange in the first area and a heat-radiating part for performing heat exchange in the second area; and a first heat medium distributed in the pipe line.


Inventors:
MIYAZAKI YOSHIRO
Application Number:
JP2012003476A
Publication Date:
July 22, 2013
Filing Date:
January 11, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANAI EDUCATIONAL INSTITUTION
International Classes:
F25B39/00; F25B27/00; F25B30/02
Domestic Patent References:
JPH01111197A1989-04-27
JP2005195187A2005-07-21
JP2008190792A2008-08-21
JP2007062683A2007-03-15
JP2006038277A2006-02-09
JP2008298342A2008-12-11
JPH04190090A1992-07-08
JP2005195187A2005-07-21
Foreign References:
WO2010032304A12010-03-25
WO2007086418A12007-08-02
Attorney, Agent or Firm:
Kurata Masatoshi
Takakura Shigeo
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori