Title:
ヒートポンプ給湯装置
Document Type and Number:
Japanese Patent JP6509368
Kind Code:
B2
Abstract:
The heat pump hot-water supply device according to the present invention is equipped with: a refrigerant circuit which is configured by a compressor, a hot-water supply heat exchanger, a heat-collecting throttle device, a heat storage heat exchanger, a main throttle device and an air heat exchanger being circularly connected by refrigerant pipes, and is configured by connecting an intake bypass pipe that causes the refrigerant flowing out from the heat storage heat exchanger to bypass the air heat exchanger and flow to the intake side of the compressor; a heat-storage-side secondary circuit which has the heat storage heat exchanger, a heat storage tank that stores heat storage material, and a heat storage pump that circulates the heat storage material between the heat storage heat exchanger and the heat storage tank; and a control device which implements operation control in such a manner that, by heat exchanging with the refrigerant in the hot-water supply heat exchanger, the water associated with hot-water supply is heated, and the storage of heat in the heat storage material or the collection of heat from the heat storage material is performed.
Inventors:
Tetsuji Seven Kinds
Makoto Obayashi
Yusuke Tsuji
Makoto Obayashi
Yusuke Tsuji
Application Number:
JP2017551443A
Publication Date:
May 08, 2019
Filing Date:
November 18, 2015
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
F24H4/02; F24H1/18; F24H4/04; F25B1/00; F25B30/02; F28D20/02
Domestic Patent References:
| JP2008196769A | ||||
| JP11118246A | ||||
| JP2008196791A | ||||
| JP2008261559A | ||||
| JP10019482A | ||||
| JP2007178091A | ||||
| JP2006090697A | ||||
| JP2001207163A | ||||
| JP2005241148A | ||||
| JP2009243866A |
Foreign References:
| WO2013046720A1 |
Attorney, Agent or Firm:
Patent Business Corporation Kisa Patent Trademark Office