To provide a compact and thin device by reducing a depth dimension of the device and reducing a wasted space in a constitution storing a heat pump circuit and a heat storage tank in one housing.
This heat pump heat storage device comprises a heat pump circuit 5 having a compressor 1, a radiator 2, a throttle means 3 and an evaporator 4, a heat storage portion 6 connected with the radiator 2 and having at least an approximate angular portion, and the housing 7 having an approximate angular portion having the approximate similar shape as the approximate angular portion of the heat storage portion 6, and the heat pump circuit 5 and the heat storage portion 6 are disposed in the housing 7 in a state that the approximate angular portion of the heat storage portion 6 and the approximate angular portion of the housing 7 are opposite to each other. As the approximate angular portion of the heat storage portion 6 and the approximate angular portion of the housing 7 are opposite to each other, the wasted space inside of the device is reduced, the heat storage portion is thinned, and the compact and thin device can be provided.
COPYRIGHT: (C)2007,JPO&INPIT
MEGATA MASAHITO
| JP2003279133A | 2003-10-02 | |||
| JP2003314892A | 2003-11-06 | |||
| JP2004085183A | 2004-03-18 | |||
| JP2005226965A | 2005-08-25 | |||
| JP2005337597A | 2005-12-08 | |||
| JPS6018455U | 1985-02-07 | |||
| JPS6312077U | 1988-01-26 | |||
| JPS6118386U | 1986-02-03 |
Hiroki Naito
Daisuke Nagano
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