Title:
ヒートポンプシステム及びその制御方法
Document Type and Number:
Japanese Patent JP6938407
Kind Code:
B2
Abstract:
To allow heat storage and heat release to be performed by using exhaust heat having a temperature below the reaction temperature of a chemical heat storage material.SOLUTION: A chemical heat pump 100 comprises a reactor 110, a condenser 120, and an evaporator 130. A vapor compression type heat pump 200 comprises an exhaust heat source heat exchanger 210, a compressor 220, a reactor heat exchanger 230 for exchanging heat with the reactor 110, an expansion valve 240, a condenser heat exchanger 250 for exchanging heat between an expanded refrigerant and the condenser 120, and an evaporator heat exchanger 260 for exchanging heat with the evaporator 130. A control device 300 executes a heat storage mode and a heat release mode. The heat storage mode is a mode for heating the reactor 110 with the reactor heat exchanger 230 to a reaction temperature or higher and cooling the condenser 120 with the condenser heat exchanger 250. The heat release mode is a mode for heating the evaporator 130 to evaporate liquid. In this way, a heat pump system 1 is provided.SELECTED DRAWING: Figure 1
Inventors:
Yoshida Taiji
Yoshihiro Kobayashi
Atsushi Shioya
Yoshihiro Kobayashi
Atsushi Shioya
Application Number:
JP2018041819A
Publication Date:
September 22, 2021
Filing Date:
March 08, 2018
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
F25B25/02; F25B1/00; F25B27/02
Domestic Patent References:
| JP2002156170A | ||||
| JP2011163730A | ||||
| JP2018506013A | ||||
| JP2017516057A |
Attorney, Agent or Firm:
Noriharu Fujita
Miori Takao
Kawakami Miki
Miori Takao
Kawakami Miki