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Title:
HEAT PUMP TYPE AIR CONDITIONING DEVICE
Document Type and Number:
Japanese Patent JP2011202811
Kind Code:
A
Abstract:

To provide a heat pump type air conditioning device improving a performance coefficient and heating function of a heat pump during heating.

An evaporator 20 for the air conditioning device includes a header pipe 22, a header pipe 23, a plurality of heat absorbing fins 21 each having a built-in U-shaped flow passage 21a where a refrigerant is made to flow, and the like. The heat absorbing fin 21 incorporates the U-shaped flow passage 21a. A first flow passage 21a1 is arranged on the upstream side of outside air 51B, a second flow passage 21a2 is arranged on the downstream side of the outside air 51B, and the first and second passages 21a1, 21a2 are communicated with each other on the lower side by a communication flow passage 21a3. In the state of heating operation, a refrigerant is made to flow in to an upper end of the first flow passage 21a1, exchanges heat with the upstream side of the outside air 51B while made to flow down, and exchanges heat with the downstream side of the outside air 51B while made to flow upwardly in the second flow passage 21a2. Since heat exchange can be performed with a gas liquid phase side with high refrigerant density in a state of a large temperature difference with the outside air 51B, at the inlet side of the refrigerant, heat exchange efficiency is enhanced compared to a heating operation cycle which is a comparison example. Thus, the performance coefficient and heating function of the heat pump are improved.


Inventors:
YAMAMOTO CHIE
YAMAOKA DAISUKE
MASUZAWA KOSUKE
KOBAYASHI SATOSHI
Application Number:
JP2010067551A
Publication Date:
October 13, 2011
Filing Date:
March 24, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
F25B39/02; B60H1/22
Attorney, Agent or Firm:
Isono Dozo
Etsuo Tada



 
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