Title:
HEAT PUMP TYPE AIR COOLING DEVICE
Document Type and Number:
Japanese Patent JP2015215117
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump type air cooling device which maintains air-cooling capacity high during a simultaneous operation of air-cooling and heating of a heated fluid, and which can execute pump-down.SOLUTION: A heat pump type air cooling device includes: an evaporator (41); a first condenser (61) for performing heat exchange between a refrigerant and a heated fluid; a second condenser (51) for performing heat exchange between the refrigerant and outside air; a compressor (46) for compressing the refrigerant sent from the evaporator (41); and first refrigerant flow control means (71, 73) for selectively forming a first refrigerant flow in which the refrigerant sent from the compressor (46) is supplied toward the first condenser (61) and the second condenser (51) arrayed in series on a refrigeration circuit (21), and a second refrigerant flow in which the refrigerant sent from the compressor (46) is supplied toward the first condenser (61) and the second condenser (51) arrayed in parallel on the refrigeration circuit (21).
Inventors:
OTA KOJI
HONDA ATSUSHI
HONDA ATSUSHI
Application Number:
JP2014097565A
Publication Date:
December 03, 2015
Filing Date:
May 09, 2014
Export Citation:
Assignee:
SHARP KK
International Classes:
F25B29/00; F24F5/00; F24H1/00; F25B1/00; F25B6/02; F25B6/04
Attorney, Agent or Firm:
Fukami patent office