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Title:
HEAT PUMP UNIT
Document Type and Number:
Japanese Patent JP2009281631
Kind Code:
A
Abstract:

To provide a heat pump unit, simplifying opening and closing operation of a bypass valve and exhibiting a predetermined performance while securing a space for a compressor.

The heat pump unit is equipped with: a refrigerant circuit 1 formed by successively connecting an evaporator 2, a compressor 3, a radiator 4, and a decompression means 5; a water circuit 7 connected to the radiator 4; and a pressure sensor provided in the refrigerant circuit 1, in which the bypass valve 6 is opened and closed based on information of a pressure sensor 8, a discharge temperature sensor 10, an evaporation temperature sensor 11 or the like provided in the refrigerant circuit 1, and refrigerant with the discharge side being in a supercritical state is circulated. According to this, the opening and closing operation of the bypass valve 6 is simplified, and the space for the compressor 3 is secured while the heat pump unit is made compact.


Inventors:
ISAYAMA YASUHIKO
NAKATANI KAZUO
Application Number:
JP2008132782A
Publication Date:
December 03, 2009
Filing Date:
May 21, 2008
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
F25B1/00
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano



 
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