Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP
Document Type and Number:
Japanese Patent JP2013040734
Kind Code:
A
Abstract:

To provide a heat pump which can improve heat exchange performance of a condenser.

The heat pump includes: an evaporator 2 which makes the heat medium heat-exchange with a high temperature heat source to evaporate the heat medium; a compressor 3 which compresses the heat medium evaporated by the evaporator 2; a condenser 4 which makes the heat medium compressed by the compressor 3 exchange heat with a low-temperature heat source; a steam trap 5 which makes the heat medium condensed by the condenser 4 expand to supply to the evaporator 2; a gas-liquid separator 6 which is arranged between the evaporator 2 and the compressor 3, separates the heat medium of the liquid phase in order to supply only the heat medium of the gaseous phase to the compressor 3; and a second gas-liquid separator 7 which is arranged between the compressor 3 and the condenser 4, separates the heat medium of the liquid phase in order to supply only the heat medium of the gaseous phase to the condenser 4. While being able to prevent failure of the compressor 3 by supplying only the heat medium of the gaseous phase to the compressor 3 by the gas-liquid separator 6, the heat exchange performance in the condenser 4 can be improved by supplying only the heat medium of the gaseous phase to the condenser 4 by the second gas-liquid separator 7.


Inventors:
ASAOKA KEN
Application Number:
JP2011179042A
Publication Date:
February 28, 2013
Filing Date:
August 18, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TLV CO LTD
International Classes:
F25B43/00; F25B1/00
Domestic Patent References:
JP2002286325A2002-10-03
JP2004148966A2004-05-27
JP2009174836A2009-08-06
Foreign References:
US6058727A2000-05-09
US6058727A2000-05-09