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Title:
HEAT PUMP
Document Type and Number:
Japanese Patent JP2016099066
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a compact heat pump when a sub-cooler is a plate type heat exchanger.SOLUTION: In a heat pump, the sub-cooler 18 is configured with the plate type heat exchanger, an accumulator 26 is positioned between a side of compressor 1,2 and the sub-cooler 18 in a width direction of an outdoor unit 50 in plan view, and the sub-cooler 18 is positioned so as to overlap on the accumulator 26 in the width direction in plan view.SELECTED DRAWING: Figure 4

Inventors:
OKUDA NORIHIRO
AIKAWA TERUNORI
KIHARA HIROTOSHI
Application Number:
JP2014237143A
Publication Date:
May 30, 2016
Filing Date:
November 21, 2014
Export Citation:
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Assignee:
YANMAR CO LTD
International Classes:
F24F1/16; F24F1/46; F25B1/00; F25B40/00
Domestic Patent References:
JP2001349623A2001-12-21
JP2004293856A2004-10-21
JP2013050283A2013-03-14
JP2001280760A2001-10-10
JP2012013302A2012-01-19
Foreign References:
KR20100036789A2010-04-08
US20130061616A12013-03-14
Attorney, Agent or Firm:
Samejima Mutsumi
Aoyama Aoi
Hiroshi Okabe



 
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