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Title:
HEAT PUMP
Document Type and Number:
Japanese Patent JP2017223424
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump with a simple structure.SOLUTION: A heat pump 10 includes: an evaporator 12 configured to evaporate a heat medium; adsorbers 20, 22 connected to the evaporator, coupled with the heat medium, and having adsorbent obtained by desorbing and regenerating the coupled heat medium at a regeneration temperature; a condenser 14 connected to the adsorber 20, 22, and configured to condense the heat medium desorbed from the adsorbent; a heat exchanger circulation passage 30 configured to circulate heat exchange fluid between the evaporator 12 and the condenser 14; and a pump 18 provided in the heat exchange circulation passage 30, and configured to feed out the heat exchange fluid.SELECTED DRAWING: Figure 1

Inventors:
HIROTA YASUKI
IWATA RYUICHI
MIZUTANI YOSUKE
YAMAUCHI TAKASHI
Application Number:
JP2016120623A
Publication Date:
December 21, 2017
Filing Date:
June 17, 2016
Export Citation:
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Assignee:
TOYOTA CENTRAL RES & DEV
International Classes:
F25B17/08
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori



 
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