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Patent Searching and Data


Title:
HEAT RADIATING STRUCTURE USING HEAT PIPE
Document Type and Number:
Japanese Patent JPS6370447
Kind Code:
A
Abstract:

PURPOSE: To radiate heat in a unit to the outside, by making it possible to attach and remove the heat radiating fins of a heat pipe readily, and contacting the heat pipe with the fins outside the unit when a printed board is inserted into the unit.

CONSTITUTION: A printed circuit board 1, on which an electronic circuit part 5 is mounted, is contained in a unit structure so that the board 1 can be inserted and removed. In this structure, a heat pipe 6, which is fixed to a heat yielding electronic circuit part 5, is extened in the inserting direction of the printed board 1. When the printed circuit board is inserted, the tip part of the heat pipe 6 is brought into contact with fixed heat radiating fins 15, which are attached to the outside of a unit 2. Since the heat radiating fins 15 are provided at the outside of the unit 2, the heat radiating effect is excellent, and handling is convenient and safe. The mounting efficiency of parts on the printed board 1 is also enhanced.


Inventors:
TANIGUCHI SHIYOUJIROU
HAYASHI HISAO
SUZUKI MITSUAKI
Application Number:
JP21273286A
Publication Date:
March 30, 1988
Filing Date:
September 11, 1986
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
F28D15/02; H01L23/427; H01L23/46; H05K7/20; (IPC1-7): F28D15/02; H01L23/46; H05K7/20
Domestic Patent References:
JPS58191649U1983-12-20
JPS6183095U1986-06-02
Attorney, Agent or Firm:
Aoki Akira