To provide a heat radiation mechanism which efficiently radiates heat occurring therein using a heat pipe and enables the heat pipe to be disposed so as to avoid other electronic components and contact with a heat radiation portion without bending the heat pipe.

A heat radiation mechanism includes a heat pipe and a heat conduction part. In the heat radiation mechanism, a thickness of the heat conduction part is set so as to be equal to or higher than a height of an electronic component, which has the highest height from a ground surface, from among all electronic components on a side of a substrate on which the heat conduction part is installed. The heat pipe is disposed so as to contact with the heat conduction part and a heat sink.