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Title:
HEAT RADIATION STRUCTURE OF ELECTRONIC CIRCUIT PARTS
Document Type and Number:
Japanese Patent JPH04188795
Kind Code:
A
Abstract:

PURPOSE: To get novel heat radiation structure being applicable even in the case where there is a difference in the heights of electronic circuit parts by adopting a constitution such that subprint boards are housed inside the case consisting of both upper and lower half bodies made of material excellent in heat conductivity and the electronic circuit parts are pressed against the inwall of the case together with the subprint board by the action of the support.

CONSTITUTION: In the condition that the subprint board 2 is supported by the main print board by means of a supporting member 6, the four corners of the main print board 1 are fixed by screws 13 to the seats 12 provided at the bottom wall of the lower half body 11. And when the upper half body 9 is put on it from above, a thick part 14, which is provided, on the inside of the ceiling, to correspond to the electronic circuit parts on the subprint board 2, presses down the heat conductive faces of the electronic circuit parts, against the elastic force of the spring members 6a of the support members 6. Hereby, even if there is a little difference in the heights of the electronic circuit parts, the difference is absorbed by the elasticity of the spring member 6a, and the thick part 14 and the electronic circuit parts can contact with each other at proper contact pressure, so the efficient heat radiation becomes possible.


Inventors:
ZENITANI HIDEKI
OKAWACHI MITSUO
SATO HISATO
HORIZOE HARUHIKO
YAMAZAKI NAOYA
Application Number:
JP31578290A
Publication Date:
July 07, 1992
Filing Date:
November 22, 1990
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01L23/40; H01L23/433; H01L23/538; H01L25/11; H05K7/14; H05K7/20; H05K1/18; (IPC1-7): H05K7/14; H05K7/20
Attorney, Agent or Firm:
Aoki Akira (4 outside)