Title:
HEAT RADIATION STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013105962
Kind Code:
A
Abstract:
To provide a heat radiation structure of an electronic component which efficiently radiates heat of the electronic component mounted on a housing.
This invention relates to a heat radiation structure of an electronic component 10 mounted on a housing 2. The heat radiation structure of the electronic component 10 includes: a bottom part 12a thermally coupled to a floor surface 3a of the housing 2 and a plate like heat pipe 12 having a side part 12b thermally coupled to at least one inner surface 4a of the housing 2. The electronic component 10 thermally couples to an upper surface of the bottom part 12a of the plate like heat pipe 12.
Inventors:
MIYAMOTO TSUTOMU
Application Number:
JP2011250067A
Publication Date:
May 30, 2013
Filing Date:
November 15, 2011
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K7/20; F28D15/02; H01L23/427
Attorney, Agent or Firm:
Kenji Sugimura
Akito Okura
Rei Ito
Akito Okura
Rei Ito
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