Title:
HEAT-RESISTANCE WIRE, HEAT-RESISTANCE INSULATING MATERIAL, AND USING METHOD AND MANUFACTURE OF HEAT-RESISTANCE WIRE
Document Type and Number:
Japanese Patent JP3289581
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable giving superior characteristics such as heat-resistance characteristics specific to PBI by improving poly benzo imidasol(PBI) film wire, etc.
SOLUTION: A Ni-Cr wire 11 of 0.5mm in its outer diameter is used, and a PBI film 12 is applied to the Ni-Cr wire 11 in a manner in it is soaked in vanish adjusted so as to be PBI 30 pts.wt. and solvent DMA 70 pts.wt. and is sintered at a wire pushing-out speed of 20m/min. and at 350°C. This is repeated eight times, and a PBI cover Ni-Cr wire is obtained. A ceramic film 13 is applied to the PBI Ni-Cr wire surface in a manner in which it is soaked in alumina vanish of a 15% toluen component, and a 15% xylene component by 20% alumina ingredient in which organopolysiloxane is a base polymer and sintered at a wire pushing-out speed of 10m/min. and at 350°C. This is repeated four times, and an alumina-organopolysiloxane/PBI covered Ni-Cr wire 10 is obtained.
Inventors:
Yasuhiko Ohnishi
Application Number:
JP29423495A
Publication Date:
June 10, 2002
Filing Date:
November 13, 1995
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
C08G73/18; H01B3/30; H01B7/29; (IPC1-7): H01B7/29; C08G73/18; H01B3/30
Domestic Patent References:
| JP5298942A | ||||
| JP4506769A |
Other References:
【文献】米国特許4665281(US,A)
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)