Title:
HEAT-RESISTANT ADHESIVE RESIN, HEAT-RESISTANT ADHESIVE COMPOSITION, AND ADHESIVE, LAMINATE, AND BONDING METHOD EMPLOYING THE SAME
Document Type and Number:
Japanese Patent JP2017122157
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive resin and a heat-resistant adhesive composition that have sufficient adhesive force at 150-250°C, have a small change in adhesive force in the temperature range and can be easily peeled, and can, optionally, improve its adhesive force, and an adhesive, a laminate, and a bonding method employing the same.SOLUTION: The present invention provides a heat-resistant adhesive resin that comprises a maleimide group at a terminal and in a side chain, by making a functional group of a condensation resin react with an epoxy maleimide compound. The present invention also provides the heat-resistant adhesive resin and a curable compound.SELECTED DRAWING: None
Inventors:
SHINADA EIITSU
MASUDA KATSUYUKI
SATO KITARU
MASUDA KATSUYUKI
SATO KITARU
Application Number:
JP2016001056A
Publication Date:
July 13, 2017
Filing Date:
January 06, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G69/48; C08F299/02; C08G69/00; C08G69/40; C08L77/00; C09J7/02; C09J11/08; C09J179/04