PURPOSE: To obtain the subject adhesive excellent in various physical properties such as solubility and low hygroscopicity, capable of retaining its bond strength even at elevated temperatures, also excellent in processability, essentially containing a polyimide produced by reaction between each specific diamine compound and tetracarboxylic acid dianhydride.
CONSTITUTION: This adhesive essentially contains a polyimide produced by reaction between a diamine compound (mixture) consisting of (A) a diamine compound of formula I (X is a 1-20C hydrocarbon or S; R is a halogen, a 1-6C hydrocarbon or a 1-6C halohydrocarbon; (a) is an integer of 0-4; wherein, plural R and (a) may differ from one another, respectively) and (B) a diamine compound of formula II (Y is methylene, O, S or sulfonyl; (n) is an integer of 0-2) at the molar ratio A/B of (10:0) to (1:9) and (C) a tetracarboxylic dianhydride of formula III (Z is a 2≥C tetravalent organic group). The component A is pref. a compound of formula IV (X is butylidene or S).
UEDA YOICHI
SHIBATA MITSUHIRO
Next Patent: SILICONE POLYIMIDE ADHESIVE