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Patent Searching and Data


Title:
HEAT-RESISTANT ADHESIVE
Document Type and Number:
Japanese Patent JPH08319470
Kind Code:
A
Abstract:

PURPOSE: To obtain a polyimide adhesive which exhibits a strong adhesion and can retain a high adhesive power even at high temps. without detriment to its heat resistance.

CONSTITUTION: This heat-resistant adhesive is made from a polymer which has at least two kinds of repeating units and is obtd. by reacting 1,3-bis(3- aminophenoxy)benzene with a mixture of at least two tetracarboxylic acid dianhydrides selected from among ethylenetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'- benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2,3,3- biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane- dianhydride, 2,2-bis (2,3-dicarboxyphenyl)propane dianhydride, etc.


Inventors:
TAMAI MASAJI
KAWASHIMA SABURO
SONOBE YOSHIO
OTA MASAHIRO
YAMAGUCHI TERUHIRO
Application Number:
JP14136496A
Publication Date:
December 03, 1996
Filing Date:
June 04, 1996
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C09J179/08; C08G73/10; (IPC1-7): C09J179/08
Attorney, Agent or Firm:
Shotaro Mogami