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Title:
HEAT-RESISTANT DEVICE, ATTACHMENT DEVICE, SPACECRAFT, AND DEVELOPMENT CONTROL METHOD
Document Type and Number:
Japanese Patent JP2023180963
Kind Code:
A
Abstract:
To reduce a thermal load in re-entry of the atmosphere even in a spacecraft mounted with a loaded article, and recover the spacecraft.SOLUTION: A heat-resistant device is provided in a spacecraft which is mounted with a loaded article and charged to space, and is developed in re-entry into the atmosphere of the spacecraft after separation of the loaded article from the spacecraft. The spacecraft has an attachment for connecting the spacecraft body and the loaded article. The attachment has such a cylindrical shape that an opening is provided at the center on the loaded article side, and includes a tip member which projects from the opening in development and is positioned at a projection position, which is the tip of the spacecraft, a covering part which is connected to the tip member and covers a gap between the tip member positioned at the projection position in the development and the attachment, and a projection mechanism which projects the tip member and the covering part from a storage position where the tip member and the covering part are stored inside the attachment before development to the projection position where the tip member and the covering part project from the opening after the development.SELECTED DRAWING: Figure 2

Inventors:
NAKANISHI TOSHIYUKI
FUJIKAKE ISAO
OGASAWARA HIROSHI
Application Number:
JP2022094663A
Publication Date:
December 21, 2023
Filing Date:
June 10, 2022
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
UNIV OF SCIENCE TOKYO
International Classes:
B64G1/62; B64G1/58; B64G1/64
Attorney, Agent or Firm:
Sakai International Patent Office