Title:
HEAT-RESISTANT EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03725
Kind Code:
A
Abstract:
PURPOSE:To improve heat resistance by compounding an epoxy resin, a curing agent for an epoxy resin and 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane. CONSTITUTION:2-(4-Hydroxyphenyl)-2-(4-maleimidophenyl)propane (A) is obtd. by performing condensation and dehydration of 2-(4-hydroxyphenyl)-2-(4- aminophenyl)propane with maleic anhydride. Then, 100 pts.wt. epoxy resin compsn. consisting of 100 pts.wt. epoxy resin (B), a curing agent (C) for an epoxy resin with an equivalent ratio of 0.1-10 based on the component B (e.g. a novolak phenol resin) and 10-400 pts.wt. component A are compounded with 0.01-10 pts.wt. curing accelerator (D) (e.g. 2-methylimidazole).
Inventors:
KITAHARA MIKIO
MACHIDA KOICHI
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
MACHIDA KOICHI
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
Application Number:
JP13458489A
Publication Date:
January 07, 1991
Filing Date:
May 30, 1989
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C07D207/452; C08G59/40; H01L23/29; C08K5/3415; H01L23/31; C07D207/44; (IPC1-7): C08G59/40; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Shotaro Mogami
Next Patent: JPH03726