Title:
HEAT-RESISTANT FILM
Document Type and Number:
Japanese Patent JPS54100473
Kind Code:
A
Abstract:
PURPOSE: Mica is directly bonded with a silicone-grafted polyolefin film by contacting during or immediately after crosslinking reaction to produce a heat-resistant film with no use of adhesive.
CONSTITUTION: Flakes or powders of mica are directly bonded with a silicone- grafted film by contacting while so-called activated groups remain near the surface of film during crosslinking or when crosslinking almost completes and the product is allowed to stand under a heated atmosphere, e.g., at 40°C for 24 hr. They form chemically firm adhesion.
EFFECT: The flame-proofing and heat-resisting properties are outstanding.
USE: Tapes for protecting electric cables.
Inventors:
SHIMIZU OSAMU
KINOSHITA AKIRA
TAKEUCHI KENZOU
KATOU YUUJI
KINOSHITA AKIRA
TAKEUCHI KENZOU
KATOU YUUJI
Application Number:
JP688878A
Publication Date:
August 08, 1979
Filing Date:
January 25, 1978
Export Citation:
Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
B32B19/02; (IPC1-7): B32B19/02