Title:
HEAT-RESISTANT FLOUR PASTE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP3726237
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-resistant flour paste where heat resistance, meltability in the mouth, palate feeling or the like is improved by partially reducing such material as WPC, albumen or starch added in order to enhancing heat-resistance of the flour paste without increasing the material.
SOLUTION: The flour paste contains 0.1-3 wt.% of octenylsuccinic acid starch in a raw material composition in addition to ordinary starch, and contains 5-30 wt.% of oil and fat.
Inventors:
Saito, Seizo
Takahashi, Isamu
Takahashi, Isamu
Application Number:
JP2002000269381
Publication Date:
October 07, 2005
Filing Date:
September 17, 2002
Export Citation:
Assignee:
SONTON FOOD INDUSTRY CO LTD
International Classes:
A23G3/00; A23G3/34; A23G3/00; A23G3/34; (IPC1-7): A23G3/00
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