Title:
HEAT-RESISTANT, HEAT-INSULATING COMPOSITE PANEL AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3089084
Kind Code:
B2
Abstract:
PURPOSE: To enhance adhesion heat resistance and heat insulating properties of a composite panel by a simple method, obtain the panel light in weight and excellent in strength, and enable the execution of an outer wall and a heat insulating material to be carried out simultaneously by joining a lightweight foamed concrete slab to a phenolic resin foam by an integrally forming method without using any adhesives.
CONSTITUTION: A raw material of a foam in the form of cream is obtained by adding a foaming agent, such as various kinds of from gasses and a carbonic acid gas, a curing agent and if necessary, other additives to a phenolic resin such as phenol formaldehyde. A formwork is set on the side of a surface of lightweight foamed concrete to which the phenolic resin foam is joined. The raw material of the phenolic resin foam is then injected inside the formwork, and foaming and curing are performed by applying heat. When this heating treatment is conducted in a dryer, heat is uniformly distributed; therefore, foaming is performed evenly. Upon curing of the phenolic resin, the formwork is removed to obtain a composite panel. The phenolic resin and the lightweight foamed concrete slab can be sufficiently joined together owing to their fine foams without using any adhesives.
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Inventors:
Osamu Nakashima
Application Number:
JP6427092A
Publication Date:
September 18, 2000
Filing Date:
March 19, 1992
Export Citation:
Assignee:
Asahi Chemical Industry Co., Ltd.
International Classes:
B29C39/10; B32B5/32; B32B13/12; E04B1/76; E04B1/80; B29K61/04; B29K105/04; B29L31/10; (IPC1-7): E04B1/80; B32B5/32; B32B13/12; E04B1/76
Domestic Patent References:
| JP59111966A | ||||
| JP5654279A | ||||
| JP53109584A |
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