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Title:
HEAT RESISTANT LAMINATE
Document Type and Number:
Japanese Patent JPH0732547
Kind Code:
A
Abstract:

PURPOSE: To provide a laminate which is superior in solder heat resistance and adhesion with a glass cloth by applying a resin composition of which the major component is a polymaleimide compound, and for which a silane compound with a maleimido group represented by a specified formula or other specified formula is blended.

CONSTITUTION: A resin composition is obtained by blending a silane compound with a maleimide group represented by a formula I and/or a silane compound with a maleimide group represented by a formula II to a thermosetting resin composition of which the major component is a polymaleimide compound. A prepreg is made by impregnating the obtained resin composition on a glass cloth. A plurality of the prepregs are laminated, pressurized and heat-molded to obtain a heat resistant laminate. R1 in the formula I and formula II shows 1-4C alkyl group.


Inventors:
KITAHARA MIKIO
ASAHINA KOTARO
Application Number:
JP17641793A
Publication Date:
February 03, 1995
Filing Date:
July 16, 1993
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
B29B11/16; B29C43/20; B32B27/04; B32B27/28; C08J5/24; B29K79/00; B29K105/08; B29K309/08; B29L9/00; H05K1/03; (IPC1-7): B32B27/04; B29B11/16; B32B27/28; C08J5/24



 
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