To provide a light-shielding film having a fine rugged structure on the surface thereof and excellent heat resistance, to be used as a diaphragm vane for controlling the light quantity of a liquid crystal projector, the diaphragm vane exposed to high temperature of 200°C or higher, or as a shutter vane or a fixed diaphragm of a digital camera exposed to high temperature during processing.
The heat-resistant light-shielding film includes a laminated film comprising a light-shielding film (B) having a film thickness of 50 nm or more formed on a resin film substrate (A) having heat resistance at a temperature of 200°C or higher, by surface treating the surface of the resin film substrate by plasma treatment or ion irradiation treatment and then sputtering, and a metal oxide film (C) with low reflectivity formed by sputtering on the light-shielding film (B). The surface roughness of the surface of the resin film substrate (A) subjected to the surface treatment is, in terms of an arithmetic average height Ra, of 0.2 to 0.8 μm; and the surface roughness of the laminated film, in terms of the arithmetic average height Ra, of 0.1 to 0.7 μm.
ONO KATSUSHI
JP2008310016A | 2008-12-25 | |||
JP2004231864A | 2004-08-19 |
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