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Title:
HEAT-RESISTANT LIGHT-SHIELDING FILM AND PRODUCTION METHOD OF THE SAME, AND DIAPHRAGM AND DIAPHRAGM DEVICE FOR CONTROLLING LIGHT QUANTITY USING THE HEAT-RESISTANT LIGHT-SHIELDING FILM
Document Type and Number:
Japanese Patent JP2012068536
Kind Code:
A
Abstract:

To provide a light-shielding film having a fine rugged structure on the surface thereof and excellent heat resistance, to be used as a diaphragm vane for controlling the light quantity of a liquid crystal projector, the diaphragm vane exposed to high temperature of 200°C or higher, or as a shutter vane or a fixed diaphragm of a digital camera exposed to high temperature during processing.

The heat-resistant light-shielding film includes a laminated film comprising a light-shielding film (B) having a film thickness of 50 nm or more formed on a resin film substrate (A) having heat resistance at a temperature of 200°C or higher, by surface treating the surface of the resin film substrate by plasma treatment or ion irradiation treatment and then sputtering, and a metal oxide film (C) with low reflectivity formed by sputtering on the light-shielding film (B). The surface roughness of the surface of the resin film substrate (A) subjected to the surface treatment is, in terms of an arithmetic average height Ra, of 0.2 to 0.8 μm; and the surface roughness of the laminated film, in terms of the arithmetic average height Ra, of 0.1 to 0.7 μm.


Inventors:
OKUBO KAZUHIKO
ONO KATSUSHI
Application Number:
JP2010214469A
Publication Date:
April 05, 2012
Filing Date:
September 24, 2010
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO
International Classes:
G03B9/02
Domestic Patent References:
JP2008310016A2008-12-25
JP2004231864A2004-08-19
Attorney, Agent or Firm:
Yoshitaka Oshida