Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT RESISTANT MULTILAYER ADHESIVE WRAPPING FILM
Document Type and Number:
Japanese Patent JP2002178473
Kind Code:
A
Abstract:

To provide a heat resistant adhesive wrapping film, in which various request characteristics (using facility or the like) of a packaging time are fulfilled as the film of a material conservation type of an unhalogenated system equipped with barrier properties and heat resistance and also disposal treatment is easy and the same is available as a film for household wrapping.

The heat resistant multilayer adhesive wrapping film is comprised of both at least one layer consisting of a resin composition (C) and at least one layer consisting of a resin composition (E). The resin composition (C) contains a liquid additive (B) at ≤3 pts.wt. for 100 pts.wt. resin comprising an aliphatic/aromatic copolymerized polyester resin (A) as a main body, in which melting point of a crystal is 110-230°C, containing 10-90 mol% component consisting of an aromatic monomer. The resin composition (E) contains the liquid additive (B) at 1-25 pts.wt. for 100 pts.wt. resin comprising an aliphatic polyester resin (D) as the main body. In this film, tensile modulus is 15-180 kg/mm2 and heat resistance is ≥110°C and adhesive work done is 5-50 g.cm/25 cm2.


Inventors:
YOSHIMURA ISAO
Application Number:
JP2000378484A
Publication Date:
June 26, 2002
Filing Date:
December 13, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI KASEI CORP
International Classes:
B32B27/36; C08G63/18; C08G63/664; C08K5/10; C08L67/02; C08L67/04; (IPC1-7): B32B27/36; C08G63/18; C08G63/664; C08K5/10; C08L67/02; C08L67/04
Attorney, Agent or Firm:
Yoshio Narai (3 others)