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Title:
HEAT RESISTANT POLYAMIDEIMIDE RESIN, AND SEAMLESS TUBULAR BODY, COATING FILM, COATING FILM PLATE AND HEAT RESISTANT COATING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2011079965
Kind Code:
A
Abstract:

To provide a heat resistant polyamideimide resin which enables to form a coating film and a seamless tubular body excellent in tensile strength and rupture elongation, and a seamless tubular body, a coating film, a coating film plate and a heat resistant coating material using the same.

The heat resistant polyamideimide resin is obtained by reacting (a) a polycarboxylic acid component including, as an essential component, a tri- or higher valent polycarboxylic acid anhydride having acid anhydride groups and carboxyl groups, (b) an imidodicarboxylic acid represented by general formula (I), (c) an aromatic diisocyanate represented by general formula (II), and (d) an aromatic polyisocyanate in a basic polar solvent. In the general formula (II), R1 and R2 independently denote H, alkyl, alkoxy or halogen. The coating material contains the heat resistant polyamideimide resin as a coating film component.


Inventors:
Yotsuya, Seiichi
Application Number:
JP2009000233360
Publication Date:
April 21, 2011
Filing Date:
October 07, 2009
Export Citation:
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Assignee:
HITACHI CHEM CO LTD
International Classes:
C08G73/14; C09D179/08