Title:
HEAT-RESISTANT POLYMER FILM AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2006176645
Kind Code:
A
Abstract:
To provide a heat-resistant polymer film having a good insulating property, low relative permittivity and dielectric dissipation factor, and small temperature-dependence thereof.
This heat-resistant polymer film comprises 90.0-99.99 pts. by mass of a polymer having imide bonds in the main chain and 0.01-10.0 pts. by mass of carbon nanotube. The film is characterized in that the linear expansion coefficient is in a range of -5 ppm/°C to +20 ppm/°C, and the volume resistivity is ≥1×1010 Ω cm. Preferably, the polymer having imide bonds in the main chain is a polyimide benzoxazol and the carbon nanotube is one combined with a metal.
Inventors:
MAEDA SATOSHI
ABE YUKIHIRO
KAWAHARA KEIZO
ABE YUKIHIRO
KAWAHARA KEIZO
Application Number:
JP2004371281A
Publication Date:
July 06, 2006
Filing Date:
December 22, 2004
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
C08L79/04; B29C41/12; C08G73/22; C08J5/18; C08K3/04; H01B3/30; B29K79/00; B29L7/00
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